Dalsa Falcon2 FA-81-4M180-01-R
Teledyne DALSA Camera
Product Family |
Falcon 2 |
Part Number |
FA-81-4M180-01-R |
Camera Type |
Area |
Sensor Type |
CMOS |
Sensor Size |
1" |
Mount |
M42 x 1 |
Resolution |
4-4.5 MP |
Interface |
Camera Link |
Color/Mono |
Color |
Frame Rate |
100-300 fps |
Max Frame Rate |
168 FPS, NA |
Salient Features
Falcon2 Color 4M
The new Falcon2 area scan cameras incorporate large resolutions and faster frame rates enabling high speed image capture with superb spatial resolution. Features such as global shutter and improved image quality make these Falcon2 cameras the camera of choice in applications where throughput, resolution and dynamic range matter. Global shuttering removes unwanted smear and time displacement artifacts related to rolling shutter CMOS devices. Inside these Falcon2 cameras is our latest CMOS sensor, which has reduced dark noise levels and improved dark offset, FPN (fixed pattern noise) and PRNU (Pixel Response Non-Uniformity) levels. In addition, region of interest features will offer opportunities for higher frame rates and new applications.
The Falcon2 cameras are compliant with GenICam™ and full Camera Link™ specifications—delivering 8 or 10 bits of data on 8 taps (frame rates are specified at 8 bits. Further, the M42x1 thread opening allows the use of your lens of choice.
NOTE : End of Life Falcon2 Color 4M; Last Time to Buy 12.2019
Feature Highlights
- 4 megapixels, 168 fps
- Bayer color filter , raw Bayer output
- Selectable 4:3 (2432 x 1728) or 1:1 (2048 x 2048) aspect ratio
- High responsivity
- Global shutter and reset
- Exposure control
- Concurrent integration and readout
- Faster frame rates through vertical windowing
- Full/Ext Mini-Camera Link
- Flat field correction
- Adjustable timing modes
- Adjustable gain and offset
- Test patterns and camera diagnostics
Programmability
- Adjustable digital gain and offset
- 8 or 10 bit selectable output
- Factory defined plus user defined flat field calibration sets
- Test patterns and camera diagnostics
Applications
- Semiconductor wafer inspection
- Surface and bump inspection
- Electronics manufacturing
- 3D solder paste inspection
- Package and bump inspection
- Automated Optical Inspection (AOI)
- 3D imaging—Laser profiling
- Solar panel inspection
- General machine vision
