Dalsa Genie Nano CXP C6200
Teledyne DALSA Camera
Product Family |
Genie Nano - CXP |
Part Number |
G3-XC01-C6205 |
Camera Type |
Area |
Sensor Type |
CMOS |
Sensor Size |
Other |
Mount |
M42 |
Resolution |
6144 x 6144 |
Interface |
CoaXPress |
Color/Mono |
Color |
Frame Rate |
|
Max Frame Rate |
43 fps |
Salient Features
Dasa Genie Nano CXP – G3-XC01-C6205 – 43 fps, 25k sensor
Introducing Genie Nano CXP-5100 NIR , a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano’s proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.
In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set—all at an incredible price.
Feature HighlightsApplicationsOrder Nano CXP
Feature Highlights
- Industry’s latest CMOS image sensors
- resolution
- Simplified set-up with field proven Sapera LT software featureing CamExpert
- Engineered to accommodate industrial enviroment with DIN connectors
- GenICan Gen CP compliant
- Higher frame rates achievable in partial scan mode
- Multi-ROI feature
- Robust metal body
- frame rate 120 fps
- 3 Year warranty
Family Specifications
| Camera Type | Area Scan |
| Sensor Technology | CMOS |
| Shutter Type | Global Shutter |
| Supported Interfaces | CoaXPress |
| Spectrum Capability | Visible (400-700 nm), Near Infrared (700-1000 nm) |
| Exposure Control | Automatic, programmable, or via external trigger |
| General Purpose I/O | SAMTEC TFM-105 type |
| Power Requirement | +12 to +24 V or Power over CoaXPress PoCXP (PoCXP requires 2 × DIN connectors min.) |
Applications
- Semiconductor wafer inspection
- Surface and bump inspection
- Electronics manufacturing
- 3D solder paste inspection
- Package and bump inspection
- Automated Optical Inspection (AOI)
- Solar panel inspection
- General machine vision
